IPC-A-610: Acceptability of Electronic Assemblies – Baltimore
IPC-A-610: Acceptability of Electronic Assemblies
With its comprehensive criteria for printed circuit board assemblies, IPC-A-610 is the most widely used inspection standard in the electronics industry — and has earned an international reputation as the source for end-product acceptance criteria for consumer and high reliability printed circuit assemblies. Now updated to lead free, and available in many languages, IPC-A-610 has been embraced by original equipment manufacturers and electronics manufacturing services companies worldwide. This training is available in several languages.
Choose from two tiers of instruction
Certified IPC Application Specialist (CIS)
CIS training focuses on what line workers, operators, inspectors, engineers and buyers need to know to inspect or make acceptance/rejection decisions regarding bare boards.
Course fee covers: Classroom training and an exam, a copy of the standard and certification.
Certified IPC Trainer (CIT)
CIT training provides expanded information and materials to prepare individuals to deliver Certified IPC Application Specialist (CIS) training. Trainers and quality supervisors are excellent candidates for instructor training, as are engineering and manufacturing supervisors. Course fee covers: classroom training and an exam, certification and comprehensive materials for preparing and delivering CIS training.
Why earn IPC-A-610 certification?
Certification in this industry-traceable program demonstrates your commitment to continuous improvement of product quality and reliability. Both the CIT and CIS programs provide individuals with a portable credential that represents their understanding of IPC-A-610.
CIT training prepares the instructor to teach all of the CIS modules. However, in CIS training only Modules 1 and 2 are required elements. Other modules may be covered based on your company’s specific needs.
- Purpose and application of IPC-A-610
- Hardware installation
- Soldering criteria, including lead-free connections
- Soldered connection requirements for connecting to terminals
- Soldered connection requirements for plated-through holes
- Surface mounting criteria for chip components, leadless and leaded chip carriers
- Swaged hardware, and heatsink requirements of mechanical assemblies
- Component mounting criteria for DIPS, socket pins and card edge connectors
- Jumper wire assembly requirements
- Solder fillet dimensional criteria for all major SMT component groups
- Soldering, such as tombstoning, dewetting, voiding and more
- Criteria for component damage, laminate conditions, cleaning and coating
CIT Program Extras
To help assure CIT candidates’ future success as trainers, the CIT program also includes:
- How to establish and maintain the integrity of the certification program
- Steps to effectively use the lesson plan and materials
- Tips on inspection
- Essential trainer skills
- Instructor guide with lesson plans, reference material and training guidance
- A copy of IPC-A-610D, Acceptability of Electronic Assemblies
- Written tests with answer keys
- A CD-ROM with visual aids and electronic copies of training-support forms