Component and PCB Sub Assembly Testing

Component & PCB Assembly Testing

The ever advancing electronics industry requires an increasing need for electronic component testing (IC testing) and component verification. The component test capabilities and component verification lab at NTS performs test and inspection to determine proper component functionality, verification or failure analysis (F/A).

NTS’microelectronics testing and engineering lab provides firms worldwide with unmatched excellence in integrated test and engineering services that support the industry from the early chip design stage to volume production. Test scope includes flip-chip, BGA, QFB and QFN packages both through-hole and Surface Mount Technology (SMT). Access our unparalleled knowledge base from which to help you design, develop, test, analyze, and debug even your most challenging projects. Improved product design, enhanced reliability, and ensure product quality are just some of the valuable results you will realize by testing your products for compliance with their electrical operating parameters. Component testing may be performed as an independent analysis of the product’s electrical properties or it may be performed in conjunction with Environmental Simulation.

  • Ball Shear
  • Cross-section (Microsection) Analysis
  • Curve trace / Electrical Characterization
  • Decapsulation (De-Cap) – Jet-etch and acid
  • Differential Scanning Calorimetry (DSC)
  • Die Shear
  • Dynamic Mechanical Analysis (DMA)
  • Fourier Transform Interferometry (FTIR)
  • Materials Characterization: DSC, TMA, DMA, TGA, and Thermal Conductivity testing
  • Mechanical testing: tensile, shear, compression, and deflection
  • Optical Inspection and external package analysis
  • Scanning Acoustic Microscopy (CSAM)
  • Scanning Electron Microscopy (SEM/EDS)
  • Solderability
  • Thermal Conductivity
  • Thermal Gravimetric Analysis (TGA)
  • Thermal Mechanical Analysis (TMA)
  • Wire bond pull testing
  • X-Ray (Live-time, non-destructive inspection of package)
  • X-Ray Flouresence (XRF)

Counterfeit Component Inspection

When it comes to guarding against counterfeit components, it’s important to note that component counterfeiters are continually evolving and improving their techniques. The electronic industry has seen a significant increase in counterfeit components/IC’s and defective components being distributed as new and unused.

Counterfeit components are not easily recognized. They may be low-cost parts with remarked or disguised part numbers that match a higher-priced military part; older parts salvaged from scrapped PC boards; or defective products discarded by reputable manufacturers and distributors. NTS can provide you with an independent third-party test program to detect and identify counterfeit components before filtering into the electronics supply-chain. Utilizing any or all of the above techniques, NTS has the staff, technology and resources to properly inspect for, detect, and identify counterfeit components and verify if a part has been altered or misidentified by inspecting and verifying the following characteristics:

  • Black-Top Detection
  • Country of Origin
  • Electrical Characterization
  • Examination of the Indents
  • Imperfections in the logo or markings
  • Incorrect Packaging
  • Marking Permanency
  • Solderability
  • Variance in Texture

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