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Destructive Physical Analysis (DPA), Failure Analysis (FA), and Counterfeit Analysis of Electronic Components

Destructive Physical Analysis (DPA) is the process of disassembling, testing, and inspecting electronic components to verify the internal design, materials, construction, and workmanship. This process of sample inspection is used to help ensure that electronic components are fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for identification of production lot problems.

The component analysis laboratory at NTS performs major analytical functions, such as Destructive Physical Analysis (DPA), Failure Analysis (FA), Counterfeit Analysis, and material analysis on electronic components. Our DPA techniques are performed in accordance with industry standards and methods used in most military and space program requirements. Solutions for production challenges may be resolved through our failure analysis procedures and verification.

From removal of encapsulant to internal visual inspections after cross section, different types of operations are performed as a part of our Destructive Physical Analysis (DPA) process. Our standard DPA program includes External Visual Inspection (EVI), Hermeticity Testing, Acoustic Microscopy, Decapsulation/Delidding, Internal Visual Inspection, Bond Pull Testing, Die Shear Testing, Scanning Electron Microscopy/Energy Dispersive X-Ray Spectroscopy (SEM/EDS), X-Ray Radiography, X-Ray Fluorescence (XRF), Microsection (cross-section) Analysis, and Optical Microscopy.

DPA is most commonly performed to MIL-STD-1580 using the test methods of:

MIL-STD-202
MIL-STD-883
MIL-STD-750

NTS has over 35 years of experience preforming Destructive Physical Analysis and is well versed in DPA procedures. In addition to the sampling of MIL-STD test methods listed above, NTS is capable of performing client specified DPA test flows, either through a client’s selection of MIL-STD test procedures or a complete DPA performed to meet a client owned procurement document.

In addition to DPA, Scanning Electronic Microscope (SEM), X-Ray Fluorescence (XRF), Energy Dispersive X-ray Spectrometry (EDS), and C-mode Scanning Acoustic Microscopy (CSAM) are used to perform in-depth failure and materials analysis on any type of electronic component. We, also, perform electrical test and verification comparing failed electronic components to their known good counterparts.

Our Counterfeit Component Test group includes industry experts and SAE committee chair working to develop the first industry-recognized test method standard to provide uniform requirements, practices and methods for testing electronic parts to mitigate the risks of receiving or using suspect counterfeit electronic parts.

Most commonly requested Destructive Physical Analysis (DPA) and Failure Analysis (FA) Tests:

Ball Shear Strength
Bond Strength
DC I.V. Curve Tracing
Die Shear Strength
Digital Microscopy
External Visual Inspection
Fluorescence Microscopy
Glassivation Layer Integrity
Sub-Micron Real Time X-ray
Internal Visual Inspection
Cross-Sectioning
Particle Impact Noise Detection
Scanning Electron Microscopy (SEM) Inspection
SEM Metallization Inspection
Solder Reflow/Moisture Sensitivity Testing
Glassivation Thickness
Metallization Thickness
Hermeticity Testing
SEM, XRF, and FTIR Elemental Analysis
Scanning Acoustic Microscopy (C Mode)
Ion Milling
Acid De-encapsulation
Sample De-lidding

Associated Testing

Common Standards

MIL-STD-02
MIL-STD-883
MIL-STD-750

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Destructive Physical Analysis (DPA), Failure Analysis (FA), and Counterfeit Analysis of Electronic Components

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Associated Testing

Common Standards

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Associated Testing

Common Standards

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